IC board could be divided into ABF, BT and MIS by the materials and process. Part of the process is based on epoxy resin as the main sealing film material, and with the copper wires which are electroplated to build on each molding layer (the figure shown as below). Therefore, the grinding wheel will simultaneously grind both epoxy resin and copper wires in the grinding process.

In addition to the grinding process of the above-mentioned substrate manufacturing. Anchor also provides the best solutions for the application grinding process of EMC packaging (Epoxy Molding Compounds), PLP panel level packaging and FOPLP, which are extended by related technologies.

Anchor provides two solutions of Vitrified finishing wheel and HSP wheel, according to the copper content of work piece and roughness requirement.

Catalogue download